The influence of geometrical imperfections in micromachined cantilevers on the extracted Young's modulus using a simple modelVAN BAREL, Gregory; DE CEUNINCK, Ward; WITVROUW, Ann et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 11, issn 0960-1317, 115027.1-115027.9Article

Poly SiGe, a promising material for MEMS monolithic integration with the driving electronicsSEDKY, Sherif; WITVROUW, Ann; BAERT, Kris et al.Sensors and actuators. A, Physical. 2002, Vol 97-98, pp 503-511, issn 0924-4247, 9 p.Conference Paper

An in-plane SiGe differential capacitive accelerometer for above-IC integrationLIANGGONG WEN; WOUTERS, Kristof; HASPESLAGH, Luc et al.Journal of micromechanics and microengineering (Print). 2011, Vol 21, Num 7, issn 0960-1317, 074011.1-074011.6Conference Paper

Optimal conditions for micromachining Si_1-xGe_x at 210 °CSEDKY, Sherif; BAYOUMY, Ahmed; ALAA, Ahmed et al.Journal of microelectromechanical systems. 2007, Vol 16, Num 3, pp 581-588, issn 1057-7157, 8 p.Article

Apparent and steady-state etch rates in thin film etching and under-etching of microstructures: I. ModellingVAN BAREL, Gregory; MERTENS, Luc; DE CEUNINCK, Ward et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 5, issn 0960-1317, 055033.1-055033.6Article

Mechanical characterization of poly-SiGe layers for CMOS-MEMS integrated applicationMODLINSKI, Robert; WITVROUW, Ann; VERBIST, Agnes et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 1, issn 0960-1317, 015014.1-015014.7Article

The 35th International Conference on Micro- and Nano-Engineering (MNE), 28 September-1 October, 2009, Ghent, BelgiumRONSE, Kurt; VAN THOURHOUT, Dries; DE GENDT, Stefan et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, issn 0167-9317, 974 p.Conference Proceedings

Self-aligned 0-level sealing of mems devices by a two layer thin film reflow processRUSU, Cristina; JANSEN, Henri; GUNN, Robert et al.Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. 2003, pp 245-250, isbn 0-7803-7066-X, 1Vol, 6 p.Conference Paper

Apparent and steady-state etch rates in thin film etching and under-etching of microstructures: II. CharacterizationVAN BAREL, Gregory; DU BOIS, Bert; VAN HOOF, Rita et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 5, issn 0960-1317, 055034.1-055034.8Article

Novel micromirror design with variable pull-in voltageBEERNAERT, Roel; PODPROCKY, Tomas; DE COSTER, Jeroen et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1248-1252, issn 0167-9317, 5 p.Conference Paper

Acid diffusion effects between resists in freezing processes used for contact hole patterningFUHRMANN, Jürgen; FIEBACH, André; ERDMANN, Andreas et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 951-954, issn 0167-9317, 4 p.Conference Paper

An experimental investigation of the surface potential in ferroelectric P(VDF-TrFE) FETsRUSU, Alexandru; SALVATORE, Giovanni; IONESCU, Adrian et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1607-1609, issn 0167-9317, 3 p.Conference Paper

Bacterial adhesion to toroidal nano-structures from poly(styrene)-block-poly(tert-butyl acrylate) diblock copolymer thin filmsSHUYAN LI; KOMAROMY, Andras Z; NICOLAU, Dan V et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 715-718, issn 0167-9317, 4 p.Conference Paper

CMOS integrated radio frequency dome resonatorWENZHE ZHOU; CROSS, Joshua D; ZALALUTDINOV, Maxim et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1220-1222, issn 0167-9317, 3 p.Conference Paper

Confined VLS growth and structural characterization of silicon nanoribbonsLECESTRE, A; DUBOIS, E; VILLARET, A et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1522-1526, issn 0167-9317, 5 p.Conference Paper

Development of a low temperature amorphous Si/Ti for integrated MEMS/NEMSLIUDI JIANG; LEWIS, G; SPEARING, S. M et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1259-1262, issn 0167-9317, 4 p.Conference Paper

Double-fin FETs based on standard CMOS approachZABOROWSKI, Michał; TOMASZEWSKI, Daniel; PANAS, Andrzej et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1396-1399, issn 0167-9317, 4 p.Conference Paper

Effects of substrate nanopatterning on human osteosarcoma cells (SaOs-2) behaviorBAKEINE, G. J; BENEDETTI, L; GALLI, D et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 830-833, issn 0167-9317, 4 p.Conference Paper

Electrostatic rotator for alignment purposes in multi electron beam systemsZONNEVYLLE, A. C; HEERKENS, C. Th. H; KRUIT, P et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1095-1099, issn 0167-9317, 5 p.Conference Paper

Embedding of single-wall carbon nanotubes into nanopores of porous alumina by electrophoresisKURASHIMA, Yuichi; SHIMADA, Shouta; TANAKA, Takeshi et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1516-1518, issn 0167-9317, 3 p.Conference Paper

Fabrication of a 3D stamp with the micro- and nano-scale patterns through combined NIL and optical lithography processesPARK, Sooyeon; KIM, Geehong; CHOI, Keebong et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 968-971, issn 0167-9317, 4 p.Conference Paper

Fabrication of diffraction grating in polydimethylsiloxane using femtosecond-pulsed laser micromachiningCHANG, Tien-Li; LUO, Shao-Wei; YANG, Han-Ping et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1344-1347, issn 0167-9317, 4 p.Conference Paper

Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bondingSVOBODA, Miloš; SLOUKA, Zdeněk; SCHROTT, Walter et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1590-1593, issn 0167-9317, 4 p.Conference Paper

Generation of metal patterns by topography-directed depositionDIANPENG QI; NAN LU; BINGJIE YANG et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1509-1511, issn 0167-9317, 3 p.Conference Paper

Highly photostable solid-state organic distributed feedback laser fabricated via thermal nanoimprint lithographyTRABADELO, V; JUARROS, A; RETOLAZA, A et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1428-1430, issn 0167-9317, 3 p.Conference Paper